Project — Packaging Design and Simulation using ANSYS

A hands-on exploration of semiconductor packaging — covering package types, ATMP processes, thermal simulation of flip-chip BGA packages, reliability testing, and 3D package cross-section modeling using ANSYS Electronics Desktop (AEDT).

🔍 Overview

• Completed a 10-day Packaging Fundamentals of Design & Technology Workshop conducted by VLSI System Design (VSD) — covering the complete semiconductor packaging workflow from chip to board.
• Gained practical experience using ANSYS Electronics Desktop (AEDT) for thermal simulation, package cross-section modeling, and reliability analysis of advanced semiconductor packages.

🛠️ Tools & Technology Stack

Category	Tool / Technology
Thermal Simulation	ANSYS Electronics Desktop (AEDT) — Icepak
Package Modeling	ANSYS Electronics Desktop (AEDT) — Q3D Modeler
Mechanical Analysis	ANSYS Mechanical
Package Type Simulated	Flip-Chip BGA
Modeling Focus	Wire Bond Package Cross-Section
OS	Windows

⚙️ Complete Workshop Flow

Stage	Description	Status
Packaging Fundamentals	Package types, industry structure, 2.5D/3D architectures, ATMP processes	✅ Complete
Thermal Simulation	Flip-chip BGA setup, material assignment, meshing, thermal analysis	✅ Complete
Meshing & Results	Solver setup, temperature contour visualization, hotspot analysis	✅ Complete
Package Testing	ATE, burn-in, reliability testing standards, performance validation	✅ Complete
Package Modeling — Setup	Die, substrate, die attach, bond pad creation in AEDT	✅ Complete
Package Modeling — Interconnects	Wire bond creation, material assignment, mold compound application	✅ Complete

📊 Key Features

Feature	Details
Thermal Simulation	Steady-state thermal analysis of flip-chip BGA — hotspot identification and gradient visualization
Package Modeling	Full wire bond package cross-section — die, substrate, attach, bond pads, wire bonds, mold
Material Assignment	Custom thermal conductivity, specific heat, and density for each package layer
Mesh Refinement	Fine mesh at critical regions — die junction and solder bump interfaces
Result Visualization	Temperature contour plots with Gaussian smoothing across 2D and 3D views
Industry Context	ATMP workflow, OSAT operations, ATE testing, JEDEC reliability standards

📁 Repository Structure

📁 Project-Packaging-Design-and-Simulation-using-ANSYS
├── 📁 01 : Packaging Fundamentals     → Package types, ATMP, OSAT, 2.5D/3D architectures
├── 📁 02 : Package Setup & Materials  → ANSYS intro, flip-chip BGA setup, material definitions
├── 📁 03 : Meshing & Results          → Mesh generation, thermal analysis, result visualization
├── 📁 04 : Package Testing            → ATE, burn-in, reliability standards, package intro modeling
├── 📁 05 : Die & Substrate Modeling   → Die, substrate, die attach, bond pad creation in AEDT
├── 📁 06 : Wire Bond & Encapsulation  → Wire bond modeling, material assignment, mold compound
└── 📄 README.md

📝 Stage Details

01 — Packaging Fundamentals  |  Package Types ATMP 2.5D/3D OSAT

Covered the complete theoretical foundation of semiconductor packaging — from DIP and BGA to advanced 2.5D/3D architectures using interposers, RDL, and TSVs. Explored the ATMP manufacturing workflow including wafer dicing, die attach, wire bonding, flip-chip, encapsulation, and reliability testing. Studied real-world OSAT operations with Micron's ATMP facility in Sanand, Gujarat as an industry case study.

📁 View Implementation Results

02 — Package Setup & Materials  |  ANSYS AEDT Flip-Chip BGA Material Properties

Launched ANSYS Electronics Desktop and set up a complete flip-chip BGA package model — including silicon die, solder bumps, substrate, and encapsulant. Assigned material properties (thermal conductivity, specific heat, density) to every layer and configured thermal power sources within the die to simulate real operating conditions.

📁 View Implementation Results

03 — Meshing & Results  |  Mesh Generation Steady-State STA Temperature Contours

Generated a refined simulation mesh with higher resolution at critical regions — die junction and bump interfaces. Defined boundary conditions, convection coefficients, and ambient temperature. Executed steady-state thermal analysis and visualized temperature contours, hotspot regions, and internal heat flow paths across 2D and 3D views.

📁 View Implementation Results

04 — Package Testing & Introduction to Modeling  |  ATE Burn-In JEDEC Package Cross-Section

Studied electrical testing methodologies — ATE, parametric/functional/speed tests, temperature corner testing. Explored reliability testing protocols — HTOL, HAST, temperature cycling, ESD, burn-in — and JEDEC/AEC-Q100 compliance standards. Introduced package cross-section modeling concepts as the foundation for hands-on AEDT modeling.

📁 View Implementation Results

05 — Die & Substrate Modeling  |  Q3D Modeler Die Attach Bond Pads

Built the foundational layers of a wire bond package in AEDT Q3D Modeler — substrate, silicon die, die attach material, and bond pads. Used precise geometry creation tools with correct material assignments (copper substrate, silicon die, epoxy die attach). Organized model hierarchy with clear naming for simulation-ready structure.

📁 View Implementation Results

06 — Wire Bond & Encapsulation  |  Wire Bonding Gold Wire Mold Compound

Created wire bonds using JEDEC 4-point profile — connecting die bond pads to substrate pads with gold wire material. Applied mold compound encapsulation to complete the package model. Finalized the full cross-section structure — ready for thermal and mechanical simulation.

📁 View Implementation Results

📚 References

ANSYS AEDT	ANSYS Electronics Desktop Student

🤝 Connect

Author	Preetham SK
Program	NASSCOM FutureSkills Prime — VSD (VLSI System Design)
LinkedIn	linkedin.com/in/preethamsk16
GitHub	github.com/PreethamSK163
Email	preethamsk163@gmail.com